This presentation is main designed for MIDH‘s service vendor to be family with MIDH‘s phone products, to adapt the technical service of MIDH as soon...
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Disclaimer This presentation is main designed for MIDH‘s service vendor to be family with MIDH‘s phone products, to adapt the technical service of MIDH as soon as possible. It‘s used just for reference. Please keep it confidential. This presentation is for MIDH Authorized Service Partners Use Only!
Otherwise, you are not to disclose this information.
Agenda Topic 1: Products tree
Topic 2: Basic knowledge of Lenovo Mobile Topic 3: Basic Repair technique Basic components introduction
Basic Repair tools introduction Fault code & Fault description
Topic 4: Repair requirements and procedure Repair environment requirements Repair platform requirements Repair procedure ESD requirements
Topic 5 : Trouble shooting
Products tree
Phone Products tree Price band
K
Tech-Heads Specs Rule Brand Image Driver
Geek
Fashion/Style Leader Form-Factors, Apps Brand Awareness Driver
Price Sensitive Value for Money Volume Driver
S
Stylish
P
Professional
A
Affordable
Business Applications Long Standby, Dual SIM Service/Reliability
Phone Products tree Product family of Lenovo Mobile
S series(Stylish)----For example: S720, S890 A series(Affordable)--For example:A390,A690 P series(Professional) ---For example: P770, P780
S890
A690
P770
K860
K series(Geek)---For example: K860 ,K900
Basic knowledge of Lenovo mobile
Phone information 1,SN , IP address, MAC address Method 1: Reading from IMEI/SN label in battery bin. Example shows here:
Method 2:by inquiring system info. Settings---About phone---Status---Serial number
Phone information 2, hardware version/code 10 digits S/N format and structure: 1 digit(plant code) + 1 digit (MIDH code: "D") + 8 digits serial number 18 digits S/N format and structure: XXX (Model code) + XX (HW code) + XXXXX (YMMDD) + XXXXXXXX (serial number)
Hardware code:70
Phone information 3, IMEI Method 1: by typing ―*#06#‖
Method 2: by inquiring system info. Setting----About phone----Status—IMEI information
Phone information 4, Software/image version 1,Check in menu: Setting---About phone----version infos
2,Check by typing: ―####5993#‖------Inner version ―####0000#‖------External version
Phone information 4, Model Please refer to label in battery bin or by inquiring system information: ―APPS---setting- About Phone‖
5, Specification(HW, SW, Accessories, ID, Pre-loaded software) The information is listed on ―Offering guide(SPECS)‖ of every product. Like here:
Phone information
*―Offering guide(SPEC)‖ is classed in ―Products materials‖ which you can download from Ftp: Refer to ―Products materials‖ page104 *It‘s just used for reference, suggest customer refer entity
Basic application 1, Software update for end user--OTA Step1: Open WLAN and ensure have connected
Step2:Setting----About Phone----system update
*If there's new software version, the phone well push information to inform user to download and install.
Basic application 2, USB storage After connecting Phone to PC, select ―USB storage ‖ or by pulling status baron screen to open ‖USB storage‖ shows here: Pulling status bar---connected as USB storage—connect to USB storage device.
Basic application 3, install the downloaded apps You need allow installation of none android market apps, And download the apps from ―Apps store‖ in Mobile. ―APPS---setting---security—unknown sources ‖
4, Uninstall the downloaded apps Method 1:---―Setting—apps----click app---uninstall‖ Method 2: long press app icon on apps list, and then click ―delete‖ sign once more.
5, Move app to SD card ―Setting---Apps---click app---Move to SD card‖ Preload app and some limited app can‘t be moved to SD card.
Basic application 6, Clear the data after using app Method1: ―setting—apps—running---select app—stop
Method2:Click right-bottom Icon, slip the pop-window toward left.
Basic application 7, Screen rotating ―Setting----display---Auto-rotate screen‖
8, Screen lock ―Setting—security----screen lock---none‖
9, Change the shortcut function on four-leaf clover Long pressing the leaf on Four-leaf clover and select app from apps list.
10, Open “USB debugging” ―Setting---developer options---USB debugging‖
Basic application 11, Clear up the brower history, buffer, cookie and user password Brower—Menu---setting----Privacy security‖
12, Revert to factory setting ―setting—backup and reset ―
13, Format SD card ―Setting---storage—SD card‖
14, Tethering&portable hotspot Share your phone‘s 3G internet connection to your computer and other devices. You need open your 3G ―Data connection‖ first. 14-1, Via WLAN hotspot
Basic application 1,Enable portable WLAN hotspot function. 2.Switch on WLAN from your computer or to other wireless devices. 3.Select your phone‘s SSID and enter the required password if any in your computer or other wireless devices. 4.You can configure your SSID name and password through you phone‘s WLAN configuration.(apps—settings--WLAN) 14-2, Via Bluetooth 1,Enable your phone‘s ―bluetooth‖ function. 2.Search and pair your phone‘s Bluetooth from the computer. 3.Once paired,connect the computer to your phone.
4,Once connected,you can now browse the internet using your phone‘s Bluetooth connection. 14-2, Via USB
Basic application 1,Connect your phone to the computer via USB cable. Make sure you have switched on the USB debugging mode. (apps—settings—developer options—USB debugging) 2,Switch on personal hot point and choose ―connect via USB‖ and check the ―USB tethering‖ to connect. (For some models, maybe need install driver in computer) 3,Accessing your phone‘s SD card from your computer is not allowed once USB tethering is being used.
15, TWO SIM CARDS 1, According to the SIM SLOT and sign to use SIM cards
2, SIM management: apps—setting—SIM management
16, GPS/Premium GPS Navigation Apps—settings—location services—activate the ―GPS satellites‖ and ―network location service‖ It‘s better to search GPS outdoor.
Basic application 17, Radio Transmission Mostly ,Need insert the earphone which phone matched, and run radio app. Touch the ―right key‖ to search channel.
18, OTG USB On-The-Go, often abbreviated USB OTG, is a specification that allows USB devices such as digital
audio players or mobile phones to act as a host, allowing other USB devices like a USB flash drive, mouse, or keyboard to be attached to them. Use mothed: Connect USB to phone using OTG cable APPS---File manager----to access the USB device.
Basic application 19, User manual 1,You can download and share the user manual from ftp web. 2,If the customer need more detailed guide, he/she can access the android support help: http://support.google.com/android/?hl=en
and Window support: http://www.windowsphone.com/en-am/how-to/wp8
*―User guide‖ is classed in ―Products materials‖ which you can download from Ftp: Refer to ―Products materials‖ page104.
Basic Repair technique
Basic components introduction Receiver 1、 Receiver: Change the analog ele-signal to voice Red line is positive electrode, black is negative electrode
2:Use Multimeter to test it’s resistance. Suppose the standard value is :32±15%Ω.
Normally work
Don‘t work Small voice
Basic components introduction Speaker(SPK) 1、one kind of Electro-acoustic devices,can change to elec_signal to Voice. Symbol:SPK
Also have the positive and negative electrode
2:Suppose the normal speaker’s resistance is near:8±15%Ω.
Normal
Don‘t work
Small voice
Basic components introduction Earphone jack
Antenna
Function: To radiate and receive radio frequency signal like
Earphone:one kind of speaker。
SymbOL:Ear
Symbol ―ANT‖
The earphone connector on mainboard:
It‘s always patched on phone housing or antenna holder
GPS/WIFI/BT/GSM/WCDMA/CDMA
Basic components introduction LCD
Liquid crystal display
TP
Touch panel
Basic components introduction MIC 1:Change the voice to electric signal
Red line (positive electrode),black(negative electrode) 2:Suppose the normal resistance is near:<2KΩ
Normal
Don‘t work
Don‘t work
Basic components introduction Vibrator(VIB) 1、Vibrator is a kind of small motor.Run it turning Under inputting correct power and signal, it’s resistance near from Ω to dozen Ω.
2:Use the DC (2V) to power it on, check if it works normally.
Use the DC to power on and check VIB.
Basic components introduction FPC
FPC: flexible printed circuit Feature: low weight、thin Connections for electrical performance
FPC connector
FPC connector on mainboard
check the connector if it‘s out of shape ,rusting ,poor soldering , or ruptured.
FPC connector on FPC
Basic components introduction Main PCBA
S890 PCBA FRONT view
S890 PCBA REAR VIEW
Basic Repair tools introduction Thermostatic electric soldering iron(L1,L2,L3)
Primarily used for the soldering of electronic components, e.g. resistor, capacitor, l oudspeaker,MIC,etc.
Heat gun (L2,L3)
Primarily used for the soldering and disassembly of IC components,e.g.CPU welding or Disassembly.
Basic Repair tools introduction Multimeter(L0 ,L1,L2,L3)
Primarily used for the measurement of DC voltage, AC voltage, resistance, triode, etc.
Stabilized power supply(L0,L1,L2,L3)
Primarily used to provide stable voltage supply to the mobile phone, can also be used to Measure working current, e.g. measuring the leakage current of mainboard , etc.
Basic Repair tools introduction Oscilloscope (L2,L3)
Oscilloscope is a commonly used electronic instrument that uses the electric deflection of Electron beams to observe voltage waveforms.It is mainly used to observe and measure Electric signals, e.g. signal test.
Frequency spectrograph (L2,L3)
It is used to measure the power and frequency of various modulated and Unmodulated signals
Basic Repair tools introduction Dedicated tweezers(L0,L1,L2,L3)
It is a tool used to pick up electronic components
Soldering flux (L1,L2,L3)
It is used to dilute the soldering point
Basic Repair tools introduction Tin embedding plate (L3)
It is mainly used for tin embedding of BGA components.
Ion fan (L0,L1,L2,L3)
Ion fan can produce positive and negative ion flows to neutralize the positive and negative Ions and dusts in the air, eliminate the adsorbing ability of dusts and clean the air within A certain scope. It is mainly used to eliminate the effects of static on sensitive components.
Basic Repair tools introduction Universal clamping fixture (L2,L3)
It is used to secure the mainboard, reduce operating difficulty and increase operating Efficiency.
Temperature measurer (L1,L2,L3)
It is used to measure the temperature of electric soldering iron to ensure that the temperature Satisfies soldering requirement.
Basic Repair tools introduction Wrist strap(L0,L1,L2,L3)
It is a tool that connects human body to earthing terminal to avoid static to damage Mainboard components.
Comprehensive test instrument (L2,L3)
It is an instrument that measures the electric performance indexes of a mobile phone
Fault code & Fault description •Purpose: To ensure that the quality conditions of the market end and after-sales end of the company's products can be accurately and appropriately reflected and the maintenance quality status of the front-end products can be properly discovered. Also, to provide an important reference basis for the company's decisions and to promote the quality of the products for continuous improvement.
•
Scope 2.1 Applicable to the company's products, including FP, SP, IdeaTab and IdeaTV; 2.2 Applicable to the failure phenomenon judgment and after-sales maintenance of the company's market end and after-sales end products;
Repair procedure (For reference)
Repair procedure I. Maintenance Required by the User II. Maintenance Receipt 1. Listen to the User's description of the failure, and understand the cause and process of the failure, the use time of the mobile phone, and the maintenance conditions; 2. Detect and confirm the failure described by the User in detail, and accurately fill in the Lenovo Mobile Phone maintenance Record Sheet, and input the information of the maintenance required by the user in CRM;
3. Check whether the machine was artificially damaged (such as falling and water seepage, etc.). Check the User's warranty information, to determine whether the machine of the User is in the normal warranty period.
Repair procedure III. Data Backup: Make a backup for the User's data first in order to warrantee that the User's data will not be lost; IV. Determine the Cause of the Failure Conduct failure reappearance according to the failure described by the User, and preliminarily determine the cause of the failure: 1. Check whether it is caused by the peripheral components such as battery and charger, etc.; 2. Check whether the User's software is of the latest version; 3. Check whether the failure is caused by improper use of menu and settings; 4. Check whether the failure is caused by poor contact of various connecting components; 5. After determining that there is a failure in the host, conduct compressive detection on the machine according to the host test method in order to test where there is another failure.
Repair procedure V. Maintenance Disassembly 1. Take good anti-static measures (wear anti-static bracelet and be effectively grounded); 2. Reasonably disassemble to avoid damage and coming off caused by the disassembly; 3. The disassembled parts shall be sorted and placed into dedicated containers; 4. Immediately affix protective film for protection of parts after disassembling the LCD, in order to avoid scratches or dirt on the LCD screen during the maintenance disassembly (direct touching on the LCD screen or scrubbing with a cloth is prohibited). VI. Failure Repair 1. Follow the determination principle ‗from easy to difficult‘ as well as ‗from peripheral to the motherboard‘, and investigate the failure piece by piece in combination with the maintenance determination process; 2. Accurately determine the failure with instruments and equipment, to avoid guessing; 3. When a faulty motherboard is recognized, pay attention to determine whether the faulty motherboard has phenomenon such as missing parts, deformation, or missing pads, etc.;
Repair procedure
4. Double-control for the disassembly and welding: welding temperature and welding time; 5. Carefully disassemble key components such as the Board To Board Connector, shaft FPC, and the FPC grounding pad, in order to avoid damage of parts due to the disassembly; 6. After the repair is completed, cleaning shall be conducted: motherboard, LCD, and appearance, etc.; 7. After the repair is completed, 5S shall be well managed. Work platforms and maintenance tools shall be placed in the right places. Long screws, antenna covers, rubber particles, and insulators shall be re-installed, to prevent missing parts during the maintenance; 8. Pay attention to the backup and recovery of the User data.
Repair procedure VII. Repair Self-inspection Conduct a comprehensive inspection on the repaired machine according to the host inspection process: (Pay special attention to the following items: 1. the appearance of the machine; 2. internal and external IMEI of the host; 3. Whether the vibration, display, ringtones, keys, calls, power on and off, and charging functions are normal. 4. Whether the User information is normal.)
VIII. Repair re-detection Other engineers shall conduct comprehensive detection on the machine based on the host inspection process: 1. Check whether the described by the User feedback is excluded;
2. Conduct inspection on various functions in accordance with the principle of full inspection principles for the host, in order to prevent remaining failure or new failure produced during the maintenance; 3. Check whether the User's data is lost.
Repair procedure IX. Record Maintenance Information
1. Accurately and promptly record the detailed maintenance information (failure phenomena, maintenance method) in system; 2. Fill in the label of failure in detail in accordance with the specifications.
X. Return to the User Return the machine to the User. Allow the User to personally confirm whether the failure is repaired, and provide daily use precautions of the machine.
XI. Bad Parts Depot Check again to determine whether there are unusual circumstances such as parts missing pieces or missing pads, etc, in the bad parts. If there is no problem after confirmation, package the bad parts properly for the depot.
Repair procedure Failure Determination and Detection Specification I. Detection Conditions
Lighting: 40W * 2 cool white fluorescent lamps. The light source is 50 to 80cm from the surface of the motherboard components. Equipment: multimeters, chargers, batteries, and DC stabilized power supply, etc..
II. Determination and Detection Method for the Failure Machine of the User
1. Visual inspection: inspect whether there is a serious man-made sign of damage during the daily use on the appearance of the failure machine of the User. Failed machines from the User with serious man-made signs of damage cannot enjoy the normal warranty. Please explain to the User.
2. Assemble the battery, SIM card, and memory card for boot test.
3. Functional failure detection: according to the User's failure description, continuously operate for 10 times to detect whether the
machine failure can be reproduced.
Repair procedure A. If the User is not able to accurately describe the failure reproduction environment, please continuously operate 10 times for conventional failure detection according to the failure phenomenon provided by User to confirm whether the User's failure is reproducible. B. If the User is able to accurately describe the failure reproduction environment, please continuously operate 10 times in combination with the failure reproduction environment of the User to confirm whether the User's failure is reproducible. C. If the User failure is not reproduced through detection, please upgrade the software of the machine to the latest version and explain the test results to the User, and at the same time return the machine to the User. D. If the User failure is reproduced, please upgrade the software of the machine to the latest version and detect whether the failure is corrected. E. If the failure cannot be excluded after the software is upgraded to the highest version, please handle in accordance with the machine replacement process or warranty process according to the purchase time of the User.
Repair procedure III. Re-detection Method for the Repaired Failure Machine 1. Visual inspection: inspect whether there is a serious man-made sign of damage during the maintenance on the appearance of the repaired failure machine. Relevant repair costs of repaired failure machine with serious man-made signs of damage shall be assumed by the repairing party. 2. Assemble the battery, SIM card, and memory card for boot test. 3. Functional failure detection: according to the User's failure description, continuously operate 10 times to detect whether the machine failure is repaired. A. According to the failure phenomenon detected due to the User's failure description, continuously operate 10 times to detect and confirm whether the User's machine failure is repaired. B. If the User's failure phenomenon is reproduced, it is proven that the failure is not repaired. It is necessary to re-start the repair process to continue repairing. C. If the User's failure phenomenon is not reproduced, it is proven that the failure is repaired. Full-function testing shall be conducted to confirm whether there are other failures. D. If other failures are found in the full-function test, the repair process shall be re-started for repairing according to the failure phenomena. E. If the failure is not repaired, or other failures are found in the full-function test, try to upgrade the software to the latest version to exclude failures led by
software problems.
Repair procedure IV. Items of Visual Inspection 1. Labels: check whether the model number, the trademark on the machine body, backing content (IMEI number, CMII ID number, SN number) is complete and correct. 2. Body appearance (whether there is dirt, damage, discoloration, scratches, abrasions, and burrs). 3. Whether there is an gap in the host casing, whether there is obvious gap between the casings, whether the assembly matches, whether the color
matches. Whether the installation is in place. Check whether the screws and screw caps are complete and in place. 4. Whether the mobile phone keypad and the side keys feel good. 5. Whether the appearance of the camera and the LCD is abnormal. 6. Whether the mobile I/O port and cap is damaged. 7. Whether the memory card cap is damaged and whether the plug in and out of the memory card plug is abnormal; 8. SIM card slot is not damaged and the switch is normal with no missing. Whether the degree of tightness is moderate; 9. Battery connecting PIN: no bent, depression, broken, and shortage conditions. 10. Battery compartment /battery: no damage, breakage, or deformation. The battery is not loose when being put into the battery compartment. 11. Whether there is an abnormal sound produced during flipping or sliding.
Repair procedure IV. Items of Full-function Test 1. Boot and shutdown functional inspection: long press the On / Off key for more than 3 seconds to detect whether the mobile phone can normally boot or shut down, and whether there is an exception during the boot and shutdown. 2. Check the charging function of the mobile phone: connect to the travel charger to detect whether the phone normal under the on / off state of the charging status. 3. Check the IMEI number: in the standby mode, enter *#06# to test whether the IMEI number displayed on the screen is consistent with the back sticker. 4. Check the software version: in the standby mode, enter ####0000# or #####5993# to detect whether the version of the software can match with the hardware and whether the version is the highest version. 5. Check the manufacturer's serial number: in the standby mode, enter ####2222# to detect whether the SN number displayed on the screen is consistent with the back sticker. 6. Restore factory settings: restore the default factory settings according to the menu operation. 7. Keyboard test: conduct key test in the standby mode to detect whether the mobile phone key is failed and insensitive.
Repair procedure 8. Touch screen test: through the normal menu operation and screen calibration, detect whether there is failure, positioning inaccuracy, or calibration failure for the touch screen. 9. Engineering mode test: in the standby mode, enter ####1111# to detect whether various functions of the mobile phone are normal through the test wizard. 10. Contrast detection: through the display menu settings, adjust the level of contrast to detect the brightness changes of screen display contrast. 11. Ringtone detection: play the system ringtones to detect whether the ringtone volume and sound quality is normal, and whether
there is any abnormal sound (change the ringtone for every three seconds, three ringtones in total). 12. Slipping/sliding detection: detect whether the flipping/sliding function (the answering hang up function has already been set) and the backlight switch is normal. 13. Recording function test: record for 5 seconds to save and playback, in order to detect whether there is interruption, delay, and
broken sound for the recording quality. 14. Camera function test: set to the highest pixels to take photos and then save and preview, in order to detect whether the image is clear and flawless (recommended to use the same model for comparison) 15. Camera function test: normally record the video, and then save and preview, in order to detect whether the video is smooth
and flawless (recommended to use the same model for comparison).
Repair procedure 16. Multimedia playback function test: detect whether the media playback function of the audio and video is normal, and whether there is exception during the operation. 17. U disk function test: detect whether the transmission and read and write functions of the U disk are normal. 18. PC synchronization test: detect whether the phone can be normally and synchronously connected, and whether the synchronization resource uploading and downloading functions are normal. 19. Call test + earphone call test: call to detect whether the actual test call quality is normal. 20. eBook test: detect whether the eBook can be normally opened and browsed. 21. Phone book copy test: detect whether the phone book can be freely copied between the phone and the card. 22. Delete the call history, time and other User records: backup of the User information has been completed, or the information can be directly deleted according to the User's instruction. Input ####7777# in the standby mode for direct deletion. 23. Bluetooth function test: open the Bluetooth function to check whether the phone can match with other Bluetooth devices, and whether there are exceptions during call or file transmission.
ESD Requirements I. Basic Introduction to ESD Generation of static electricity: electrostatic discharge between two objects is the ESD known to us. Electrostatic hazard: during electrostatic release, the voltage is high, the current is low and the time is short. Electrostatic discharge may cause device damage: (1) Complete loss of function: the device cannot be used
(2) Intermittent loss of function: the device can be operated but unstable in performance. Therefore the maintenance frequency is increased. Common failures are crashes and automatic shutdowns, etc.
Trouble shooting
The general principles 1,Looking Any damage in appearance? Like Touching panel, I/O connector, LCD, keypad, battery connector. The software version is right? 2,Listening To get the Phenomenon description from customer by listening. 3,Asking To ask the using enviroment and habit. For example for the signal issue:what about the signal from Base Station ? It can compare with the other phone. The speaker issue: maybe the using enviroment is dusty.etc. 4,touch To check the software version To check the setup in the phone. Disassemble the phone to check structure and circuit . The general principle to check is: Enviroment (Base station signal)
Software (version and setting)
Hareware
The general principles
1,Appearance check
•Connector broken • component fractured •LCD/TP broken •FCP not connecting well •PINS Bad soldering •Speaker dustproof broken •Antenna assembly error….
2,Electrical measurement
3,Substitution
•Can use Multimeter to test the : Power,
•Use the normal component to
resistent, conductivity .etc.
instead and check it.
Compared to normal one. •Test the starting-up current to confirm if having leakage current or circuit shorted.
Examples 1.Non-starting up 7.Receiver fault 2.No ring tone 8.No signal
3.LCD display abnormal 9.Failure in earphone 4.Abnormal charging 5.SIM card\T-flash card unidentified 6.No reply or unable to record sound (but with ringing)
Example—1.Non starting up Is it ok ,after software update(latest) ?
YE S
Software update
N O If is the battery correctly fixed. & voltage>3.4V ?
NO
Battery or connectivity fault
YE S Is normal the phone set‘s leakage current and current of starting-up?
N O
PCBA Fault
YE S N O
If LCD FPC /POWER KEY well connected with main board YE S Replace PCBA
Replace or re-solder LCD FPC/Power key
TIPS: Can use Stabilized power supply to test the leakage and current of startingup.Compare with normal and same type phone.
Example—2.No ring tone If ok,after making software update(latest)?
YE S
Software update
N O Check if setting volume level lowest? N O Check if any thing or bad assembly blocking the sound hole? N O
Check the circuit around speak and if speaker well connected with main board ? YE S If ok,after replacing speaker? N O Replace Main board
N O
YE S
Re-soldering
Replace speaker
TIPS: Can use Mulimeter to test the resistance of speaker, compare with the normal one.If the speaker is bad , It‘ ll always be different.
Example-3.LCD display is abnormal YES
If ok after software update(latest)?
Software update
N O Check if LCD damaged? N O Check if LCD FPC connected with PCBA well? ye s Check If the LCD circuit is normall?
TIPS: It‘s easy to mix up no backlight and no display. NO
Re-soldering or replace PCBA
ye s If ok after replace with new LCD ? N O Replace PCBA
NO
Replace LCD
Example—4.Abnormal charging Is it ok?after software update(latest)
yes
Software update
N O If battery failure? N O
yes
If battery connector failure? N O
yes
Re-soldering connector or replace PCBA
If the I/O connector failure? N O
yes
Re-soldering I/O port or replace PCBA
If the charger or USB cable failure?
yes
N O Replace PCBA
Replace battery
Replace USB cable
TIPS: Can use Multimeter to test the voltage and resistance of battery to compare with the normal one.Or use substitution method.
Example-5.SIM card\ T-flash card unidentified After software update(latest), does it work?
yes
Software update
NO Does the other SIMs card\T card work?
yes
SIM card\T cardfailure or unmatching
N O Check if SIM card\T card connector is well soldered and and SIM circuit normal? YE S Replace PCBA
NO
Resoldering or replace PCBA
TIPS: Near SIM card connector,there always be a sign to show which kind SIM card to insert and how to insert.
Example-6.Ringing but no reply or record sound Does it work after software update(latest)? yes
Software update
N O If the sound hole of MIC be blocked?
yes
Clear the block
N O
If the MIC components failure? N O If the MIC is on a SUB PCBA, is the PCBA connected well with Main steel board? N O Reconnect SUB-PCBA
yes
yes
Replace MIC components
Replace PCBA
TIPS: Can use Mulimeter to test the resistance of MIC(line pin), compare with the normal one.If the speaker is bad , It‘ ll always be different.
Example—7.Receiver fault If ok,after making software update(latest)?
YES
Software update
NO
Check if setting volume level lowest? N O Check if any thing or bad assembly blocking the sound hole? N O Check the circuit around speak and if receiver well connected with main board ? YE S
NO
Re-soldering
If ok,after replacing receiver?
YES
Replace receiver
NO Replace Main board
TIPS: Can use Mulimeter to test the resistance of receiver.compare with the normal one.If the receiver is bad , It‘ ll always be different.
Example—8.No signal Does if work after making software update(latest version)? N O
Does the other phone have the problem in the same place? N O
YES
Software update
yes
Base station issue
Check the setting if the service closed,or in fly mode?
yes
Phone setting
N O Check if is the antenna components damaged and RF cable connected well? N O
YES
Replace PCBA
Replace antenna components or reconnect RF cable
Example—9.Failure in earphone Does it work after making software update(latest version)?
yes
Software update
N O Is the earphone original matching to the phone?
NO
Change to original matching earphone
yes
Phone setting or replace earphone
yes
Re –soldering or change the jack or PCBA.
ye s Does the other earphone work in the same phone? Or any setting for sound off in the phone N O If any sundries in earphone jack? N O Any fault about earphone jack soldering
Q&A
Questions ?